Plating equipment (Cu) with full-automatic carrier for printed wiring board.

FEATURES

1. Various device compositions according to different product specifications.
2. Anti-pollution technology without actuators on the tank.
3. Quality improvement by submerged regular jet system and precision filter etc.
4. Simple configuration for anode supply, checkup and maintenance.

Plating equipment (Cu, Ni,, Sn-Pb, etc) with full-automatic carrier for printed wiring board.

FEATURES
1. High accuracy for hoisting and stopping.
2. Slow-up start and slow-down stop driving gear.
OPTIONS:
1. Stock Yard
2. Automatic Loading System
3. Automatic Unloading System
4. Liquid End Equipment
5. Automatic Filing Equipment

Removal equipment for resin smear which has generated at the time of the Kung-Ming process of a multilayer printed board.

FEATURES
1. Corresponding to wide range of board size
2. Reduction of the processing time by a compulsory solution supplying into through-hole and improvement in ensuring smear removal in a pore.
3. Corresponding to a thin board by stable performance of a horizontal carrier system.
4. Cost saving for the chemical solution process by an etching solution regenerating system.
5. The purity for close environment by a high sealing configuration.

Minimum plating equipment for the required part of electronic circuit board.

FEATURES
1. Stable performance for a rider carrier.
2. Efficient performance for a Liquid-end.
3. Stable electric supply.
4. Established masking technology protects the dispersion of film thickness.
5. Easy maintenance.

Hard chrome plating equipment for automobile piston rings etc.

FEATURES
1. Uniform film thickness.
2. Space-saving design.
3. Efficient production by effective use of a processing tub.

Barrel plating equipment for small components such as electronic parts..

FEATURES
1. Simple automatic injection and ejection by an open barrel specification.
2. High speed operation with current efficiency
3. High-end plating with tunic homogeneity.
4. Improvement of the yield and expansion of applicable product.